Electromigration in Metals. Fundamentals to Nano-Interconnects, Hardback/***

Learn to assess electromigration reliability, and design more resilient chips, from this comprehensive resource. Building from fundamental physics to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. This is an ideal text for materials scientists and chip design engineers. Publisher: Cambridge University Press Number of pages: 430 Publication date: 2022 Dimensions: 176 x 251 x 27 Cover type: Hardback